Sepha to demo VisionScan 3D at KOREA PACK 2024

We are excited to return to KOREA PACK 2024, the premier international trade fair for packaging machinery, processing, and materials, held in the KINTEX Exhibition centre in Goyang-si, South Korea from 23rd to 26th April 2024.

Join us and our partner, Korea Unicom, at booth 3D301 in Hall 3.0. On display will be the VisionScan 3D, our innovative non-destructive leak test solution for blister packs. The VisionScan 3D utilises advanced 3D imaging technology, in line with ASTM standard F3169-16, to offer pharmaceutical manufacturers a reliable, accurate, and efficient method for ensuring the integrity of their packaging without compromising the product.

This event presents a fantastic opportunity for industry professionals to explore the latest advancements in package integrity technologies and discuss their package requirements in more detail.

We look forward to sharing our expertise, showcasing the VisionScan 3D, and discussing how our non-destructive leak test solutions can contribute to enhancing the quality and safety of your products.

See you at KOREA PACK 2024!